mAgic® DA320 non-pressure sinter paste
For RF amplifier and power discrete
- Non-pressure sinter at 200°C and above
- High shear strength above 50 MPa
- Thermal conductivity above 200 W/mK
- 90 mins fast sintering
- Low porosity
Heraeus Electronic returns to NEPCON Japan after two years of the pandemic. This year, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.
Stop by at our booth and learn our latest material.